Flux-free soldering with 20kHz ultrasonic soldering pot for wire tinning system

Fluxless Soldering by 20khz Ultrasonic Soldering Pot for Wire Tinning System We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe\'s Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure ref

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Fluxless Soldering by 20khz Ultrasonic Soldering Pot for Wire Tinning System
 

Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System

We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations.

 

Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.

A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this. 

A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond.

Coating a ceramic with solder is an example of this process.

 

When to use Ultrasonic Soldering

There are two main reasons for using Ultrasonic Soldering:

1. To eliminate the need for flux in the soldering process

2. To apply solder to ceramics and similar materials

The advantages of removing flux from the process are that there is no need for post-process

cleaning and wicking caused by surface tension from the flux is removed. Eliminating post-process

cleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit of

eliminating wicking is that the solder coating on the base material can be better controlled.

Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System
Model No.RPS-DS20
Ultrasonic Frequency20Khz
Maximum Output1000 Watt
Temperature Range150 ~ 400 °C
Power Supply220V / 50-60 Hz
Ultrasonic GeneratorSize250(W) x 310(L) x 135(H) mm
Weight5 Kg
FeatureUltrasonic Amplitude Adjustable
Pot dimension20*15cm
Avail Soldering MatrialITO Glass, AL, Mo, Cu etc.,
 

Characteristics 

  • Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.

  • No need for flux

  • Reliable bonding/sealing

  • Best used in difficult, small-surface places with limited access


Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System
  • Aluminum components

  • Ferrite components

  • Glass components

  • Silicon wafers

  • Ceramic components

  • Semiconductor chips

  • Metals etc.

Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System
Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System
Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System
Fluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning SystemFluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning SystemFluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning SystemFluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning SystemFluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning SystemFluxless Soldering by 20kHz Ultrasonic Soldering Pot for Wire Tinning System
 

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